Design Methodology

Tahoe RF Semiconductor Inc. is an end-to-end fabless semiconductor developer and a solutions provider for RF/Analog IC components. Tahoe RF design flow includes:

• System and Chip architecture
• Front-end Circuit Design and Simulation
• Back-end layout, DRC/LVS, post layout simulation
• Fully packaged parts including Test Development
• Fabrication Support and Management
• Volume Production

Tahoe RF has developed a rigorous design flow that has proven itself in consistently delivering first time silicon successes. It includes design reviews and checkpoints to ensure that a project doesn't proceed to next phase without appropriate due diligence.  The latest EDA tools and foundry-certified design kits are employed throughout.

• Customer Kickoff Review – Align target specifications with customer requirements
• PDR – Preliminary Design Review
• CDR – Critical Design Review
• TRR – Test Readiness Review
• FDR – Final Design Review

Engineering Prototype Flow

Tahoe RF will then manufacture the design using low cost prototype flow, using multi-project-wafer (MPW) run. The resulting samples are then verified for functionality and performance in a lab-bench setting. Furthermore, the customer is then able to validate the device in the end application. This option allows for verification of the ICs in advance of committing to high volume and high-cost production:

Production Tooling Flow 

Tahoe RF follows established industry practices to provide spec-compliant, reliable product, and works with our customers to qualify a product in the end application to ensure that it is production worthy.

Subsequent to the delivery and customer acceptance of pre-production devices, and upon the completion of product characterization and qualification, Tahoe RF Semiconductor Inc. will provide the following documents for approval:

• Final Device Specification (and Waiver Acceptance if required)
• Characterization Report
• R & QA Report
• Initial Production Delivery Quantities and Schedule