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"Ready
for IBM Technology" Program for Semiconductor Products Expanded Wednesday
April 9, 7:00 am ET
Now
Includes Foundry and ASIC Solutions, in Addition to PowerPC Offerings
NEW ORLEANS, LA--(INTERNET WIRE)--Apr 9, 2003 -- At developerWorks Live!
here today, IBM announced it is extending support for solution developers
who are working with its semiconductor products.
IBM's Ready for IBM Technology program has been expanded beyond its standard
PowerPC products to include foundry and ASIC (application specific integrated
circuit) solutions, reinforcing the company's increased focus in all three
areas.
"The expansion of the Ready for IBM Technology program is a win-win for
IBM, Business Partners, and customers," said Jim Northington, vice president
of marketing and business development, IBM Technology Group. "Adding foundry
and ASIC solutions to the program helps customers speed their time to
market, reduce their development risk, and generally make it easier to
do business with IBM."
Under the IBM Ready for Technology program, Business Partners follow a
set of procedures to ensure that their products will work with various
IBM semiconductor solutions. Ready for IBM Technology solutions include
software, complementary hardware, design tools and flow, libraries and
IP, and design services. The complete business solution is validated,
including processor and chipsets, operating systems, middleware, IP cores,
foundry design flows and foundry libraries.
The Ready for IBM Technology offerings make it easier for Business Partners
to work with IBM, helping customers create innovative technologies and
respond quickly to market demand and opportunity. Participants use a mark
to highlight validated solutions and gain exposure to those solutions
on IBM Web sites.
As part of today's announcement, 13 IBM Business Partners for foundry
and four IBM Business Partners for ASIC have validated their offerings
and are now qualified to use the Ready for IBM Technology mark, demonstrating
that third-party technology is compatible with a wide variety of IBM Microelectronics
Division solutions. In addition, 15 IBM Business Partners have previously
validated their solutions in combination with the IBM PowerPC microprocessor
and related standard products.
The following IBM Business Partners have validated solutions and are qualified
to use the Ready for IBM Technology mark:
ASIC Solutions
Denali Software Inc.
Modelware, Inc.
Silicon Logic Engineering
Tensilica
Foundry Solutions
Cadence Design Systems, Inc.
insyte Corporation
Kisel Microelectronics AB
Magma Design Automation
The MOSIS Service
QThink
RF Integration, Inc.
Sierra Monolithics, Inc.
Synopsys, Inc.
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Tahoe RF Semiconductor, Inc. |
Triscend Corporation
Virtual Silicon Technology, Inc.
PowerPC and Standard Products Solutions
Abatron AG
Corrent Corporation
IP Infusion, Inc.
Macraigor Systems
Mai Logic Incorporated
MontaVista Software
NetConscious, Inc.
Nexthop Technologies
OSE Systems
Prime Layer Software, Inc.
Silicon & Software Systems
SlickEdit, Inc.
Spider Software
Wasabi Systems
Wind River Systems
The following IBM Business Partners are planning to validate their solutions with IBM Foundry technologies:
ACCO
Basecomm Pte Ltd.
Envara, Ltd.
Ericsson Technology Licensing
Nano Silicon Pte Ltd.
Silicon & Software Systems
SOCLE Technology
TelASIC Communications
For more information on the Ready for IBM Technology program for semiconductor products, please visit www.ibm.com/chips/products/wired/alliances/.
About IBM Microelectronics
IBM Microelectronics is a key contributor to IBM's role as the world's premier information technology supplier. It develops, manufactures and markets state-of-the-art semiconductor and interconnect technologies, products and services. IBM Microelectronics activities are focused in three major areas: custom application specific integrated circuit (ASIC) chips, PowerPC-based standard chip products, and high-tech foundry services. Its superior integrated solutions can be found in many of the world's best-known electronic brands.
IBM is a recognized innovator in the chip industry, having been first with advances like more power-efficient copper wiring in place of aluminum, faster silicon-on-insulator (SOI) and silicon germanium transistors, and improved low-k dielectric insulation between chip wires. These and other innovations have contributed to IBM's standing as the number one U.S. patent holder for 10 consecutive years. More information about IBM Microelectronics can be found at: www.ibm.com/chips.
Contact: Rick Bause
Company: IBM
Title: Public Relations Manager
Voice: 845-892-5463
Email: rbause@us.ibm.com
Source: IBM
icon and emphasis for Tahoe RF Semiconductor, Inc. added.
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