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Engineers from IBM Microelectronics' Wireless Division
form new RFIC Design Company
AUBURN, California, Jan. 8, 2003 - A team of engineers formerly with IBM
Microelectronics' Wireless Division have formed a new radio and analog
integrated circuit design company, Tahoe RF Semiconductor, Inc. Tahoe
RF provides front-end circuit design and simulation all the way to back-end
layout, DRC/LVS, post-layout simulation and fully packaged fabrication
management using Cadence software.
"This experienced team has worked together for over six years with
repeated first silicon success," noted Irshad Rasheed, Tahoe RF president.
"Now we are pleased to continue as a team to provide customer-specific
analog and RFIC chipsets, designs and IP to customers."
"Forming Tahoe RF Semiconductor allows us to use our extensive analog
and RFIC experience in the same team setting that led the way at IBM,"
stated Christopher Saint, Vice President of Engineering and the author
of two best-selling IC layout books. "As IBM reassessed its needs
for in-house wireless design expertise, our primary focus was to keep
this team together. This is one of the best RFIC design teams in the world."
The Tahoe RF Semiconductor team has designed, laid out and successfully
fabricated many products, including an entire WCDMA wireless chipset with
analog baseband filters, 2GHz direct down conversion receiver, dual transmit/receive
WCDMA PLL/synthesizers, IF VGA circuits, RF VGA circuits, pseudo direct
upconvert transmit chip, 2GHz quadrature generation and 4GHz VCO. Other
recent projects include a JCDMA transmit/receive chipset with integrated
frequency synthesizers, CMOS and ECL standard cell libraries, 8GHz RF
divide by 4 and dual modulus dividers, and CDMA2000 IF downconverter.
Located an hour from Lake Tahoe in California, the location is considered
a plus for attracting experienced engineers and also provides ready access
to Silicon Valley.
ABOUT TAHOE RF SEMICONDUCTOR, INC.
Tahoe RF Semiconductor, Inc. provides world class customer-specific analog
and RFIC chipsets, design and IP for expanding wireless markets. Launched
in 2002 by key engineers and managers from the IBM's Wireless Division,
this team has repeated first silicon spec-compliant success. Located in
the Sierra Foothills near Lake Tahoe in Northern California, Tahoe RF
is able to provide customers with the prompt and high quality services
they require-from front-end architecture, design and simulation to back-end
layout, DRC/LVS, post-layout simulation and fully packaged fabrication
support and management. For additional information, see www.TahoeRF.com.
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